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題 名 | Optimization of Activation and Promotion Steps for Direct Plating on Substrates Used for Surface Laminar Circuit=薄層線路上進行直接電鍍時對活化與促進化步驟之最適化 |
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作 者 | 王建成; 江怡穎; 王詠雲; 萬其超; | 書刊名 | Journal of the Chinese Institute of Chemical Engineers |
卷 期 | 28:6 1997.11[民86.11] |
頁 次 | 頁463-467 |
分類號 | 472.16 |
關鍵詞 | 薄層線路; 直接電鍍; 活化; 促進化; Direct plating; Surface laminar circuit; |
語 文 | 英文(English) |
中文摘要 | 本研究係對薄層線路(SLC)進行直接電鍍法中程序之改進。所研究之底材對象為probimer-52,由實驗發現鍍層之品質受觸媒濃度和硫化鈉促進劑濃度之綜合影響。最佳之硫化鈉濃度為0.5g/l,加以浸漬1.5分鐘,其電鍍速率可達1.76mm/min。 |
英文摘要 | The feasibility of applying direct plating to surface laminar circuit (SLC) system via Pd/Sn catalyst and N□S promotion has been explored. The substrate to be tested was Probimer-52. It was found the palatability is strongly influenced by combination of the concentration of Pd catalyst and sodium sulfide. An optimal concentration of N□S was found to be 0.5 g/l with an immersion time of 1.5 minutes. The plating rate was found to reach 1.76 mm/min. |
本系統中英文摘要資訊取自各篇刊載內容。