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題 名 | 熱分析設計擺置法在多晶片模組上之應用=The Study of Thermal Dissipation Placement for MCM Applications |
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作 者 | 陳隆建; 黃有榕; 傅勝利; | 書刊名 | 義守大學學報 |
卷 期 | 4 1997.08[民86.08] |
頁 次 | 頁109-119 |
分類號 | 448.552 |
關鍵詞 | 多晶片模組; 擺置; 功耗; Multichip module; Placement; Power dissipation; |
語 文 | 中文(Chinese) |
中文摘要 | 多晶片模組構裝的成功與否,熱量的管理具有決定性的地位。本文主要針對多晶 片模組中晶片的擺置作一適當性的規劃,以使多晶片模組的熱量分佈均勻,提高多晶片模 組的效能及可靠性。文中提出一修正之力指向擺置法,是以多晶片模組中各晶片的功耗為參 數, 經過此力指向擺置法的計算後,得各晶片在基板上的位置,再經由 Ansys 軟題中有限 元素法的分析,模擬出多晶片模組的溫度分佈圖。本文旨在提出一擺置法以降低多晶片模組 的最高溫度及避免局部高溫的出現。 |
英文摘要 | An important aspect of multichip packaging is its thermal management. In this paper, we focus on the placement of the power dissipating chips on the multichip module substrate. The main design issue is addressed on the chip placement to achieve uniform thermal distribution. The improvement in the thermal management can therefore enhance the multichip module thermal performance and reliability. Our approach to the placement problem is based on the modified force-directed placement method. The individual chip power dissipation is used to modified the Z and S membership functions. The normalized forces between the chips are calculated by these membership functions. The chips are then placed in the computed locations. In addition, the thermal distribution is simulated with the Ansys tool which is based on finite element method. Our placement method is applied to a multichip module for a case study. The experimental results show our approach can obtain better thermal distribution than other traditional placement methods. |
本系統中英文摘要資訊取自各篇刊載內容。