頁籤選單縮合
題名 | A Review of the Technology Development of Direct Metallization=直接電鍍製程之分析討論 |
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作者 | 萬其超; Wan, Chi-chao; |
期刊 | Proceedings of the National Science Council : Part A, Physical Science and Engineering |
出版日期 | 19990500 |
卷期 | 23:3 1999.05[民88.05] |
頁次 | 頁365-368 |
分類號 | 472.16 |
語文 | eng |
關鍵詞 | 直接電鍍; 貴金屬活化劑; 碳膠體液; 導電高分子; Direct metallization; Direct plating; Direct copper plating; |
中文摘要 | 本文就直接電鍍技術之發展歷史和成因作一文獻整理。文中也將目前工業上常用 之相關製程按其性質分為貴金屬活化劑,碳膠體液和導電高分子三類。第一類之反應機構較 為複雜,本文也就現有之研究成果加以分析。 |
英文摘要 | This paper reviews the technological development of direct copper plating and its reason. This paper also presents a classification of the existing processes based on its chemical nature, namely, a preciousmetal activator, carbon colloidal solution and conductive polymer. The process with activator has a more complex reaction mechanism, which is also analyzed. |
本系統之摘要資訊系依該期刊論文摘要之資訊為主。