頁籤選單縮合
題 名 | Hydroquinone Oriented Growth Control to Achieve High-quality Copper Coating at High Rate for Electronics Interconnection |
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作 者 | Zheng, Li; Wang, Chong; Cai, Deng'an; Huang, Yunzhong; Adi, Kegu; Hong, Yan; Chen, Yuanming; Zhou, Guoyun; Armini, Silvia; De Gendt, Stefan; Wang, Shouxu; He, Wei; | 書刊名 | Journal of the Taiwan Institute of Chemical Engineers |
卷 期 | 112 2020.07[民109.07] |
頁 次 | 頁130-136 |
分類號 | 460.02 |
關鍵詞 | High rate electrodeposition; Copper interconnection; Hydroquinone; Copper nanocube; Organic additive; |
語 文 | 英文(English) |