頁籤選單縮合
題名 | Simulation of Wire Bonding Process Using Explicit FEM with ALE Remeshing Technology= |
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作者 | Yang, C. C.; Su, Y. F.; Liang, Steven Y.; Chiang, K. N.; |
期刊 | Journal of Mechanics |
出版日期 | 20200200 |
卷期 | 36:1 2020.02[民109.02] |
頁次 | 頁47-54 |
分類號 | 448.5 |
語文 | eng |
關鍵詞 | Wire bonding; Electronic packaging; Arbitrary Lagrangian-Eulerian; ALE; Contact force; Explicit time integration; LS-DYNA; |