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題名 | Low Temperature and Pressureless Cu-to-Cu Direct Bonding by Green Synthesized Cu Nanoparticles= |
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作者 | Liu, Wei; Wang, Hung; Huang, Kuo-shuo; Wang, Chang-meng; Wu, Albert T.; |
期刊 | Journal of the Taiwan Institute of Chemical Engineers |
出版日期 | 20210800 |
卷期 | 125 2021.08[民110.08] |
頁次 | 頁394-401 |
分類號 | 460.02 |
語文 | eng |
關鍵詞 | Cu nanoparticle synthesis; Green chemistry; Cu oxide reduction; Sintering; Low temperature bonding; Power electronic packaging; |