查詢結果分析
相關文獻
- Six Sigma Case Study: Bond Finger Nodule LRR Improvement
- 提升服務有形程度的行銷原則--模式建構與實驗研究
- The Optimal Hydrodynamic Design of a Three-Phase Draft-Tube Fluidized Bed with an Orthogonal Array
- 企業教育訓練成效評估模式之實驗研究--以燁隆鋼鐵公司為例
- 應用因子實驗設計法改善工業用油配方
- 社區民眾健康促進自我導向學習經驗研究--以學童母親自我導向學習急救知能為例
- 應用灰色GM(1,N)模型及田口實驗法於塑膠射出成型加工上之研究
- 電腦輔助視覺傳達設計--平面構成轉換的實驗設計
- 三線包縫針步爆破強力統計分析
- 藉由電腦輔助,執行高品質,低成本之公差設計
頁籤選單縮合
題 名 | Six Sigma Case Study: Bond Finger Nodule LRR Improvement=六標準差案例研討:金手指凸起批退率改善 |
---|---|
作 者 | 鍾慶達; 何俊明; 連志偉; | 書刊名 | 品質學報 |
卷 期 | 23:4 2016.08[民105.08] |
頁 次 | 頁215-227 |
分類號 | 494.56 |
關鍵詞 | 球形陣列; 打線基板; 批退率; 六標準差分析; 實驗設計; Ball grid array; BGA; Wire-bonding substrate; Lot reject rate; LRR; Six sigma methodology; Design of experiments; |
語 文 | 英文(English) |
中文摘要 | 打線型封裝技術自1990年代即開始用來支援高腳數的產品設計,接合墊 (形似手指) 的品質將影響封裝良率。經過層別分析,「金手指凸起」為打線不良的首要缺點。為改善此問題,團隊參考了六標準差的分析方式來層別問題的原因,並透過一連串的實驗找出最適方案;改善成效顯著降低進料批退率,提升客戶滿意度的同時亦為內部相關品質成本節省了70.8%。 |
英文摘要 | Since 1990's, ball grid array (BGA) assembly technology was developed by Motorola and Citezen to support high I/O count design requirement. IC substrate is a primary carrier and widely used by the BGA assembly technology. Bond Finger (BF) nodule defect contributes as top 1 defect of overall defects and caused customer high LRR (Lot Reject Rate) on wire bonding substrate. Hence, it is important to identify the root causes to reduce this failure. To improve this problem, Six Sigma Methodology is deployed on this project (Pande et al., 2002). Initial investigation indicates several factors in Ni plating process. By Cause & Effect Matrix and Pareto analysis, four factors are clarified as most possible root causes. To tackle this problem, DOE was conducted to find the optimized process control conditions. After improvement, the customer LRR reduce from 0.27% to 0.04% and 70.8% cost saving. It is encouraging to deploy the quality improvement with Six Sigma Methodology. |
本系統中英文摘要資訊取自各篇刊載內容。