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題 名 | Wafer Probe Mark Area Estimation Via Digital Image Processing Approach=利用數位影像處理方法估測晶圓探針痕面積 |
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作 者 | 王朝興; 張文亮; | 書刊名 | 工業工程學刊 |
卷 期 | 29:4 2012.06[民101.06] |
頁 次 | 頁237-245 |
分類號 | 440.8 |
關鍵詞 | 探針痕; 導體; 影像處理; 打線接合; Probe mark; Wafer; Semiconductor; Image processing; Wire bonding; |
語 文 | 英文(English) |
英文摘要 | This article presents a digital image processing approach applied to estimate the probe mark area on semiconductor wafer pads. The value of mark area can be used to judge the acceptance of the wafer. Before wire bonding to the wafer, a probing needle contacts each pad to test the electrical characteristics of the chip. However, this contact leaves probe marks on the pad. A large probe mark area results in poor adhesion forces at the bond ball of the pad, thus leading to undesirable products. Traditionally, given the difficulty of calculating the area of the irregular probe mark, probe mark area calculations were substituted by calculating the area of the oval that is manually drawn to cover the probe mark area. Nevertheless, this method is inaccurate, and the results varied from person to person. In this article, we present an imaging processing approach to calculate the probe mark area utilizing high-magnification microscopes to capture probe mark images. Our approach is faster and more accurate compared to the traditional method. |
本系統中英文摘要資訊取自各篇刊載內容。