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題 名 | Effects of Printed Circuit Board Surface Finish and Thermomechanical Fatigue on the Microstructure and Mechanical Strength of Small Outline J Leads/Sn-X (X=AgCu and Pb) Solder Joints=不同焊料及不同PCB鍍層於熱疲勞處理後對SOJ/Sn-X (X=AgCu及Pb)焊點之微結構及構械強度之影響 |
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作 者 | 吳沛霖; 黃孟槺; 李嘉平; 昝世蓉; | 書刊名 | Journal of the Chinese Institute of Chemical Engineers |
卷 期 | 35:5 2004.09[民93.09] |
頁 次 | 頁571-579 |
分類號 | 472.14 |
關鍵詞 | 焊料; PCB鍍層; 熱疲勞處理; 焊點; 微結構; 機械強度; Lead free solder; Sn-Ag-Cu; Surface finish; Ni/Au; Organic solderability preservative; Lead back side contact angle; Load bearing length; Thermomechanical fatigue; Mechanical strength; |
語 文 | 英文(English) |
中文摘要 | 實驗結果顯示負荷承受長度愈長時,焊點之起始拉力強度則愈大。因此,負荷承受長度為剛焊接完焊點起始機械強度的關鍵決定因素。且不論何種焊料,OSP鍍層均較Ni/Au鍍層顯示出較長之負荷承受長度及較大之起始拉力強度。不同焊料與不同PCB鍍層之焊點的拉力強度皆隨TMF次數增加而降低,但不同焊料拉力強度降低之程度並不相同。不論何種鍍層隨著TMF次數增加均導致SnPb焊料中的Pb顆粒粗化,而這是造成SOJ/SnPb焊點拉力強度下降之主因。而SOJ接腳和SnAgCu焊料間之介金屬層厚度隨著TMF次數增加而變厚的現象則是造成SOJ/SnPb焊點拉力強度下降的原因。 |
英文摘要 | The effects of printed circuit board (PCB) surface finish and thermomechanical fatigue (TMF) on the microstructure evolution and mechanical strength of SOJ/SnAgCu and SOJ/SnPb solder joints were investigated. Experimental results revealed that the load bearing length decreased as the lead back side contact angle increase. The load bearing length determined the initial pull strength of the as-soldered solder joints. The pull strengths of the solder joints decreased as the number of TMP cycles increased. Gradual coarsening of the Pb particles in the SnPb solder matrix due to TMF resulted in a decline in the pull strength of the SOJ/SnPb solder joints. Thickening of the IMC layer at the interfaces of SOJ lead and SnAgCu solder due to TMF caused the strength of the SOJ/SnAgCu solder joints to decrease. |
本系統中英文摘要資訊取自各篇刊載內容。