查詢結果分析
來源資料
相關文獻
- 基板偏壓對反應濺鍍TiAlN鍍層的影響
- 錫負極薄膜材料製備及電化學特性之研究
- Recent Advances in the Synthesis and Properties of Amorphous and Crystalline Carbon Nitride
- AISI 304不銹鋼以PVD法披覆硬膜之耐蝕性研究
- 氫氧基磷灰石/鈦磁控濺鍍膜微結構及性質研究
- 以射頻濺鍍法備製非晶形三氧化鎢薄膜及其感測特性之研究
- 以電漿濺鍍技術製備鈀-銀合金薄膜於氫氣分離之研究
- The Growth Process and Characterization of Y[feb5]Ba[feaf]Cu[feb0]O Superconducting Thin Films
- 反應性磁控濺鍍氧化鎢薄膜氧含量對其電致色變性質之影響
- Si/Ta/Cu UBM鍍層之結合強度
頁籤選單縮合
題名 | 基板偏壓對反應濺鍍TiAlN鍍層的影響=Effects of Substract Bias on the Reactive Sputtered TiAlN Films |
---|---|
作者 | 黃肇瑞; 許博淵; 林振富; Huang, J. L.; Shew, B. Y.; Lin, C. F.; |
期刊 | 真空科技 |
出版日期 | 20010700 |
卷期 | 14:2 2001.07[民90.07] |
頁次 | 頁13-18 |
分類號 | 440.33 |
語文 | chi |
關鍵詞 | 基板偏壓; 濺鍍; TiAlN鍍層; 鍍層材料; |
中文摘要 | 利用陶瓷鍍層來改善材料表面的耐磨耗性質,是一種既經濟且有效的方式,並且以在刀具及模具上廣泛應用。在耐磨耗鍍層追求更高使用性能的發展過程中,多層份的TiAlN鍍層則是近年來及受矚目的新鍍層材料。本實驗是以直流反應磁控濺鍍方式,研究基板偏壓對鍍層性質的影響。而結果顯示,基板偏壓的施加,造成薄膜產生再濺射現象而使濺鍍速度下降;而偏壓的施加也使沉積原子的活動力及反應性增加,始能在較低的氮氣流量達到計量比,且能產生較大晶粒的薄膜結構。 |
英文摘要 | Ceramic hard coatings have been widely used to improve the wear resistance of molds and tools. Multicomponenet TiAlN film is a newly developed coating materials with potential for high temperature application and high speed finishing operation. In this study, TiAlN films were deposited by DC magnetron reactive sputtering, the effects of substract bias on the TiAlN films were explored. Results indicated that the deposition rates decreased as substract bias increased due to the resputter of films; The mobility and activity of deposited atoms increased as substract bias increased, so a stoichiometric composition of TiAlN at lower N2 flow rate and larger grain size microstructure could be obstained. |
本系統之摘要資訊系依該期刊論文摘要之資訊為主。