頁籤選單縮合
題名 | 論述IC整合元件製造商之策略聯盟與技術移轉--以華邦電子為例=Strategic Alliance and Technological Transfer of Taiwan's Integrated Device Manufacturer Industry--A Case Study of Winbond Electronics Corporation |
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作者 | 曾芳美; | 書刊名 | 玄奘學報 |
卷期 | 3 2001.01[民90.01] |
頁次 | 頁217-234 |
分類號 | 555.77 |
關鍵詞 | 策略聯盟; 技術移轉; 華邦電子; IC; |
語文 | 中文(Chinese) |
中文摘要 | 近年來臺灣IC產業蓬勃發展、技術進步一日千里,已蔚為臺灣重要產業之一。然IC產品與技術生命週期短且技術研發費用日愈提高使得IC產業經營者考量降低風險與成本、取得技術、開拓市場、增加獲利等因素而以策略聯盟的方式結合聯盟伙伴彼此的優勢。臺灣IC產業的發展就像一部策略聯盟與技術移轉之歷史,各IC製造公司皆因不同因素而有聯盟活動。本文以個案分析法分析華邦電子公司策略聯盟與技術移轉策略的擬定與評估其策略聯盟的成效,以作為其他企業尋找策略聯盟伙伴與擬定策略時之參考。 |
英文摘要 | Due to the high compound annual growth rate arousing high capital expenditure among the swift changing IC environment which arising high business risk, most of the decision makers in Taiwan IC industry adopt strategic alliance with their partner to reduce the risk, saving cost, acquire technology, extend market and increase profit. This research used case study method to analysis and to evaluate the performance of Winbond Electronics Corporation about how to plan the strategic alliance and technological transfer. Base on this demonstration, the industry can find out how to developing suitable strategy and the whole processes. |
本系統之摘要資訊系依該期刊論文摘要之資訊為主。