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題名 | Composite Electroforming Applied for LIGA Process= |
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作者 | 楊錫杭; 林勍閬; 鄭永添; |
期刊 | 復興學報 |
出版日期 | 19991200 |
卷期 | 1999.12[民88.12] |
頁次 | 頁173-177 |
分類號 | 448.57 |
語文 | eng |
關鍵詞 | 電鑄; LIGA; Electroforming; Thickness uniformity; |
英文摘要 | Electroforming is an important step in the LIGA process. Illustrated effective methods to improve, hardness and thickness uniformity in electroforming for the LIGA process to produce metallic microstructures are described. The result shows the internal stress of Ni-Co alloy deposit can be well tuned between 2 ∼ -2 kg/mm �� by adding a stress release agent into the electroplating bath and hardness of Ni-Co alloy can be achieved to Hv500. A secondary cathode is applied to improve the thickness uniformity in electroforming without losing growth rate at the center of the features. |
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