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各著作權人授權國家圖書館,敬請洽詢 nclper@ncl.edu.tw
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題 名:
Investigation of Polyvinylpyrrolidone as an Inhibitor for Trench Super-filling of Cobalt Electrodeposition:
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作 者:
Ni, Xiuren
Chen, Yuanming
Jin, Xiaofeng
Wang, Chong
Huang, Yunzhong
Hong, Yan
Su, Xinhong
Zhou, Guoyun
Wang, Shouxu
He, Wei
Chen, Qingguo
- 書刊名:
Journal of the Taiwan Institute of Chemical Engineers
- 卷 期:
112 2020.07[民109.07]
- 頁 次:
頁232-239
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被引用次數:期刊(0) 博士論文(0) 專書(0) 專書論文(0)
排除自我引用:0
共同引用:0
點閱:0
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題 名:
Polymer-based Cu/Ag Composite as Seed Layer on Insulating Substrate for Copper Addition of Multi-dimensional Conductive Patterns:
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作 者:
Li, Jiujuan;
Hong, Yan;
Zhou, Guoyun;
Zhang, Huaiwu;
He, Wei;
Wang, Shouxu;
Chen, Yuanming;
Wang, Chong;
Su, Xinhong;
Sun, Yukai;
Andersson, Martin;
- 書刊名:
Journal of the Taiwan Institute of Chemical Engineers
- 卷 期:
123 2021.06[民110.06]
- 頁 次:
頁254-260
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被引用次數:期刊(0) 博士論文(0) 專書(0) 專書論文(0)
排除自我引用:0
共同引用:0
點閱:0
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題 名:
Direct Surface In-Situ Activation for Electroless Deposition of Robust Conductive Copper Patterns on Polyimide Film:
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作 者:
Wang, Yuefeng;
Hong, Yan;
Chen, Qingguo;
Zhou, Guoyun;
He, Wei;
Gao, Zhengping;
Zhou, Xin;
Zhang, Weihua;
Su, Xinhong;
Sun, Rui;
- 書刊名:
Journal of the Taiwan Institute of Chemical Engineers
- 卷 期:
97 2019.04[民108.04]
- 頁 次:
頁450-457
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被引用次數:期刊(0) 博士論文(0) 專書(0) 專書論文(0)
排除自我引用:0
共同引用:0
點閱:0